Sensor technology to meet your needs

The patented NEXT Active Thermal™ principle allows the development of large, high quality fingerprint sensors in both rigid and fully bendable and flexible formats
NEXT technology thrives in challenging environments


NEXT Active Thermal™ Sensing Technology

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NEXT Active Thermal™ sensing technology produces clear, high-contrast images which lead to low biometric error rates. Accurate fingerprint images are recorded consistently under a variety of environmental conditions, including high humidity and rain. The NEXT Active Thermal™ sensor even works under water!


The patented NEXT Active Thermal™ sensing principle works by measuring heat conductivity. A low power heat pulse is applied to each sensor pixel over a short period of time and a response is measured. This response is different for pixels in proximity to a finger’s ridge or valley – to more effectively record fingerprint data.

NEXT Active Thermal™ sensors are manufactured using LTPS technology – the same technology used to make thin film transistor (TFT) screens for mobile phones and TVs. The manufacturing process for LTPS is economical even for very large area sensors. If desired, the sensing structure can be deposited on a flexible substrate, allowing the manufacture of flexible sensors — the ideal solution for smart cards.

“By developing and commercializing large, cost-efficient, high security fingerprint products, NEXT Biometrics will provide leading global system integrators and device manufacturers the means to replace password, PIN codes, signatures, photo-IDs and physical keys with the ultimate keys of security and convenience – the unique prints of the human finger.” 

– Magnus Mandersson, Chairman of the Board – NEXT Biometrics

Meeting quality critical requirements

The capabilities and features enabled by NEXT Active Thermal™ and our large active sensor area results in a superior solution.

  • Large active sensor area for reliable operation.
  • Thin form factor for industrial design freedom.
  • Well-suited for high security applications.
  • Appropriate for “convenience”-oriented markets.
  • Allows for One Touch enrollment.
  • Low rate of false rejections & false acceptance (Low FRR and FAR).
  • Distortion-free image.
  • Cost advantages with larger sensor size.
  • Suitable for integration into small footprint devices.
  • Fully flexible, large area sensor for integration into smart cards.

Comparison of sensor technologies

The following chart compares capabilities and features enabled by NEXT Active Thermal™ technology with other technologies available on the market. The chart describes what NEXT customers already know – NEXT’s biometric sensor technology is superior.

Key Technology Attributes for Biometric Fingerprint Sensors NEXT Biometrics Active Thermal™ Capacitive Silicon Optical
Large Active Sensor Area for reliable operation ✔✔✔ ✔ High cost per area drives smaller sensor size. ✔✔✔
Thin Form Factor for industrial design freedom ✔✔✔ ✔✔✔ No. Optical modules are bulkier than silicon or polysilicon.
High Security Applications ✔✔✔ ✔ Most sensors are too small and not suitable. ✔✔✔
Convenience Applications ✔✔✔
One Touch Enrollment ✔✔✔ ✔ Most sensors are too small. ✔✔✔
Accuracy ✔✔✔ ✔ Higher reject rate on smaller sensors. ✔✔✔
Distortion free image ✔✔✔ ✔✔✔ ✔ Distortion can be high on low-cost optical scanners.
Flexible Sensor for smart cards. ✔✔✔ ✔ Silicon will break when bent. This can be partially compensated for by making the sensor even smaller and moving it toward the card’s corner. No. Optical modules are too bulky.



Dual Interface Film
NEXT One Touch Enrollment and Authentication
Proven High Performance Fingerprint Sensor Technology for Dual Interface Smart Cards